ChangChun Plastics. Co. Ltd. Sales Network

ChangChun Plastics. Co. Ltd. Product List

Product Total：83 Product Page：
	1

Product Name

MF

CAS

Details

O,O'-Dioctadecylpentaerythritol bis(phosphite)

C41H82O6P2

3806-34-6

Details

3-Bromopropyne

C3H3Br

106-96-7

Details

POLY[(O-CRESYL GLYCIDYL ETHER)-CO-FORMALDEHYDE]

C33H42O9X2

29690-82-2

Details

Azabenzene

C5H5N

110-86-1

Details

FLEXIBLE COPPER CLAD LAMINATE

Details

PBGA

Details

Resin epoxy

(C11H12O3)n

24969-06-0

Details

HEXAMINE

Details

COPPER ELECTROLYTE

Details

Polyvinyl Butyral Interlayer Film

Details

DRY PAPER STRENGTH RESIN

Details

MOLD CLEANER

Details

Sodium formate

CHNaO2

141-53-7

Details

Trimethylol propane

C6H14O3

77-99-6

Details

Chromium

Cr

7440-47-3

Details

FURFURYL ALCOHOL RESIN

C21H26O3

25212-86-6

Details

RECYCLED CLEANING LIQUID

Details

INSULATION PAPER

Details

PLASTICIZER

Details

N,N'-Methylenebisacrylamide

C7H10N2O2

110-26-9

Details

POLY(VINYL ALCOHOL)

(C2H4O)n

25213-24-5

Details

Acetic acid glacial

C2H4O2

64-19-7

Details

polymer flocculant

Details

LIQUID PHOTO RESIST

Details

PHENOLIC COPPER CLAD LAMINATES

Details

HIGH SOLIDS AMINO CROSSLINKING AGENT

Details

THERMO PLASTIC POLYESTER ELASTOMER

Details

PHOSPHITES ANTIOXIDANTS

Details

NA

Details

LACQUER THINNER

Details

POLY(VINYL BUTYRAL)

27360-07-2

Details

PAPER-PHENOLIC COPPER CLAD LAMINATE

Details

GLASS FIBER (SHORT FIBER)

Details

N/A

H2O2

Details

PROPYLENE GLYCOL METHYL ETHER ACETATE

C6H12O3

84540-57-8

Details

4,4'-DIHYDROXYDIPHENYLMETHANE

C13H12O2

620-92-8

Details

ETHYL 2-CYANOACRYLATE

C6H7NO2

7085-85-0

Details

UREA RESIN MOLDING COMPOUND

Details

UREA RESIN ADHESIVE

Details

PvcStabilizer

Details

EPOXY RESIN MOLDING COMPOUND

Details

POLY BUTYLENE TEREPHTHALATE RESIN

Details

s-Trioxane

C3H6O3

110-88-3

Details

OVER-LAY RESIN

Details

SINGLE SIDE PPCCL

Details

E-GLASS FIBER CHOPPED STRAND

Details

DRY FILM PHOTO RESIST

Details

HIGH PURITY HYDROGEN PEROXIDE FOR SEMI-CONDUCTOR

Details

SYNTHETIC RESIN FOR COATING

Details

WET PAPER STRENGTH RESIN

Details

Epoxidized soya bean oil

8013-07-8

Details

MELAMINE RESIN MOLDING COMPOUND

Details

FORMAL SALINE

CH2O

Details

MOLD CLEANER FOR SEMI-CONDUCTOR

Details

POLYETHYLENE DRUM

[C2H4]n

Details

Methanol

CH4O

67-56-1

Details

3-Picoline

C6H7N

108-99-6

Details

ETCHING LIQUID

Details

Copper

Cu

7440-50-8

Details

CHEMICAL MECHANICAL POLISHING

Details

ELECTRONIC GRADE PROPYLENE GLYCOL MONOMETHYL ETHER

Details

BROMINATED EPOXY FLAME RETARDANT

Details

Carbomer 940

C3H4O2

9003-01-4

Details

RECYCLED FOIL

Details

ELECTRONIC GRADE STRIPPER FOR SEMICONDUCTOR

Details

PHENOLIC RESIN MOLDING COMPOUND

Details

ELECTRONIC GRADE ETHANOL AMINE

Details

ULTRA THIN MULTILAYER

Details

ELECTRONIC GRADE THINNER FOR SEMICONDUCTOR

Details

TEXTILE RESIN

Details

POLYVINYL ACETATE EMULSION

Details

HINDERED PHENOL ANTIOXIDANTS

Details

POLY(VINYL ALCOHOL-CO-ETHYLENE)

26221-27-2

Details

PHENOL-FORMALDEHYDE RESIN

C7H6O2

9003-35-4

Details

melamine resin adhesive

Details

Butyl acetate

C6H12O2

123-86-4

Details

EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION

Details

TRIPHENYL PHOSPHATE FLAME RETARDANT

Details

ELECTRONIC GRADE PROPYLENE GLYCOL MONOMETHYL ACETATE

Details

ELECTRONIC GRADE NORMAL BUTYL ACETATE

Details

Nicotinic acid

C6H5NO2

59-67-6

Details

GLASS EPOXY COPPER CLAD LAMINATE

Details

TETRAHYDROFURAN, FOR HPLC [SUBSTITUTED BY 34865 RIEDEL]

C4H8O

Details

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