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SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS)

CAS No.
Chemical Name:SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS)
Synonyms:SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS)
CBNumber:CB0660183
Molecular Formula:O2Si
Formula Weight:60.0843
MOL File:Mol file
SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS) Property
Safety

SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS) Chemical Properties,Usage,Production

SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS) Preparation Products And Raw materials
Raw materials
Preparation Products
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SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS)
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